automatic shutdown of the ventilation motor when the blower is placed on his arm rest, adjustable temperature -stable once the setpoint atteint-, I use mainly "recovery" for desoldering SOIC circuits, tssop, and QFP QFN. It is highly advisable to obtain specialized nozzles for CI square footprint, especially when working with QFP 144 and beyond, in order to avoid having to "turn" around the component, and risk not not provide uniform heat. On the other hand, it is important to remember that the use of such iron is primarily a school of patience. The user pressed too will tend to approach the pcb blower to reach as soon as possible melting point. He will get it for sure, but it also reaches the release temperature of the pcb tracks.
