The CPU (AMD Phenom II X6 Thuban) is without overclocking in a stress test at full capacity with my Scythe heatpipe cooler not warmer than 58 ° C. The normal temperature is about 30-35 ° C.
The graphics card was a bit more complicated, since the distance between GPU and heatsink has changed repeatedly for spring mounting. Therefore, I have heated with hot air Gas Solder first the Liquidmetal pad on the GPU, then with another small piece of Liquidmetal placed the copper foil on it and then reheated. One sees immediately when it liquefies.
For result: when a stress test the GPU was only 68 ° C hot place previously with dried-cooling paste 108 ° C. Normal temperature is about 47 ° C.
It pays so.
Absolute buy recommendation. A little tinkering and it works. The Liquid Metal pads but must be tailored as closely as possible.
Tip: the CPU / GPU / chip with a little spit on your finger, moisten (Sounds disgusting, but helps a lot), Liquid Metal Pad lay on it and cut off with a scalpel or very sharp Cutter carefully while keeping a finger pad for safety's sake.