Worked very unclean, poorly packaged.

One of the ICs stands there like a bucking horse, this was soldered despite DIP construction rather than SMD. The pins have different lengths, and probably completely by transport without solid packaging, also varying depending on the pin, bent.

The ESD protection package had surpised me positively, but is of no use when it is pierced by the solder, and the only packaging.

2 points ensure that it works at the moment; 2 points deduction that can be expected with the failure of several solder joints.